The MultiPrep™ System is a programmable machine that enables precise semiautomatic sample preparation of a wide range of materials for microscopic (optical, SEM, FIB, TEM, AFM, etc.) evaluation.
Capabilities (from Allied’s brochure):
- Capabilities include parallel polishing, angle polishing, site-specific polishing or any combination thereof.
- Dual micrometers (pitch and roll) allow precise sample tilt adjustments relative to the abrasive plane.
- A rigid Z-indexing spindle maintains the predefined geometric orientation throughout the grinding/polishing process.
- Digital indicators enable quantifiable material removal, which can be monitored real-time (front), or preset (rear) for unattended operation.
- Variable speed rotation and oscillation maximize use of the entire grinding/ polishing disc and minimize artifacts.
- Adjustable load control expands its capability to handle a range of small (delicate) to large samples.
- Dual micrometers (pitch and roll) allow precise sample tilt adjustments relative to the abrasive plane.
Location
NanoES G65B
Primary Contact
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See the manufacturer’s brochure for more product information:
