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Facilities

Pulsed Laser Deposition

Status note December 2022: The PLD is out-of-service at this time. Please check back for updates on its status or contact the superuser for more information.

Pulsed laser deposition (PLD) is a laser-based technique used to grow high-quality thin films of complex materials on substrates like Silicon wafers. The material to be deposited (target) is vaporized by short and intense laser pulses and forms a plasma plume. Then, the vaporized target material from the plasma bombards the substrate and creates a thin homogenous layer on this substrate. For each laser shot, a layer of only a few nanometers of material is ablated to form the plasma plume in a process that typically lasts a few tens of picoseconds. To enable this process, nanosecond pulses from a fully contained excimer laser with energies of tens to hundreds of mJ are necessary.

Capabilities
  • Precise deposition of chalcogenide monolayers from bulk chalcogenide targets
  • High vacuum sample chamber for high purity deposition conditions
Location

Roberts Hall 116

Primary Contact

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Thermal Evaporator

This custom deposition system is a modular instrument for preparation of thin film metal-halide perovskite materials. The vacuum chamber is equipped with a Pfeiffer ACP40 backing pump and a 10″ Pfeiffer turbo pump allowing fast pump down times to a base pressure of ~1×10-5 torr. Substrates up to 12″ x 12″ can be accommodated on a linear translation rail. The vacuum chamber has numerous feedthroughs on its base and side walls that allow for installation and testing of custom deposition sources.

Capabilities
  • Resistive thermal evaporation with a Luxel RADAK II deposition source.
Location

MolES 140A-2

Primary Contact

Click here to view the facility contacts.